MIL OSI – Source: TU Berlin –
Headline: Programme: DFG – Priority Programme “High Frequency Flexible Bendable Electronics for Wireless Communication Systems (FFLexCom)” (SPP 1796)
Mittwoch, 20. September 2017…”Vision and GoalsIn the past electronic devices have mainly been advanced regarding performance, power consumption and costs. A further interesting property of future electronics is mechanical flexibility, which can come together with advantageous features such as bendability, stretchability, light weight, ultra thinness, transparency, large area integration and easy recyclability. These properties can be achieved by modern TOLAE (thin film organic and large area electronics) technologies.
Cut-off frequencies up to the 100 MHz range and bending radii down to 3 mm were reported for TOLAE devices such as transistors. These recent achievements indicate a novel promising research area: Wireless communication systems fully integrated on ultra-thin, bendable and flexible substrates such as plastic or even paper. Hence, conventional rigid circuit boards would not be required any more. However, to enable functional flexible systems and sufficiently high operation frequencies for wireless communications, the speed of flexible TOLAE devices and circuits must be massively increased. […]
Focus of the Second PhaseIn the first phase the focus was mainly put on material research, the design and modelling of devices, as well the design of simple basic circuits. In the second phase, further corresponding improvements are encouraged. However, compared to the first phase, the priority is put on circuits with higher complexity, transmitters, receivers, complete transceiver frontends, system packaging, as well as the demonstration of wireless transmissions using TOLAE technology.”…
Hier finden Sie die vollständige Ausschreibung.
(Quelle: DFG Informationen für die Wissenschaft, Nr. 63, 15.09.2017)